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  • Industry 4.0 Automatic Drying Equipment
Products
  • Industry 4.0 Automatic Drying Equipment
  • Dust-Free Oxygen-Free Drying Equipment
  • General Drying Equipment
  • Specialized Drying Equipment
  • Customized Conveyor Drying Equipment
  • Environmental Testing Drying Equipment
  • Preheat Drying Equipment
  • Multi-functional Software System
AGV, RGV, MGV Automated Guided Vehicle Dust And Oxygen-Free Oven
AGV, RGV, MGV Automated Guided Vehicle Dust And Oxygen-Free Oven
Merchandise number:AQWOL
Description:
  •  Fully Automated Oven.
  •  Compatible with automated/rail guided vehicles, as well as electric and manual trolley (MGV).
  •  It can seamlessly upload relevant data directly to the server, realizing the vision of an unmanned and automated factory.

Features

Key Technologies for Smart Automation
  • Automated oven system, seamlessly integrated with AGV and RGV, and featuring advanced carrier design for efficient material loading and unloading.
  • Implementing a range of sensors and controllers, seamlessly integrated with the control system interface through the Internet of Things (IoT).
  • Implementing CPS cyber-physical system to improve the utilization of production capacity and efficiency with smart software design.
  • Creating a database system, for electronic batch record and quality traceability.
  • Real-time integration with upstream and downstream processes for achieving unmanned operations and quality monitoring equipment.

Application


        Industry automation in manufacturing for drying productions includes semiconductor, PCB, LED, electronics, etc. The equipment such as industrial dust-free drying oven, semiconductor drying equipment, circuit board drying equipment, PCB industrial oven, ABF carrier board drying equipment, touch panel drying equipment, N2 hot air oven. 

PC/PLC Controlled Oven Specification

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Specification
Process temperature RT ~300℃
Temperature uniformity ± 1.5%
Cleanliness ISO14644-1 Class 5 @ 0.3 µm
Oxygen Content 1%
Carrying Capacity Customizable
Operation interface User-Friendly operation interface, complies with CIM, Ethernet & SECS/GEM, PCB ECI
Options Fast air-cooling system, solvent recovery system,Quick-detachable inner liner
Process PCB D/F, Lamination, Plug Hole, Solder Mask, SAP, Bumping, Panel Fan-out
Compatible Equipment AGV/RGV/MGV
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