Semiconductor
PI/PR curing for wafer/panel-level packaging.
PCB
D/F, solder mask and SAP curing with AGV loading and PCB ECI
Energy Materials
High-temp bake, sintering, vacuum degassing for solar, MLCC
Machinery
Aging, annealing, tempering, ashing for parts and molds
Optoelectronics
Clean baking, degassing and UV drying for LED, LCD and backlights
Aerospace
Aerospace part drying, curing, tempering and R&D/QA tests