Applications
Curing Ovens
Hand-loading means long changeover waits.
Challenge 2: Bake data not traceable
Handwritten lot temperature logs can't meet PCB ECI.
Challenge 3: Drying safety risk
Solvent vapor and long bakes make night-time faults hard to catch.
Solution 1: AGV auto loading
Oven doors dock with AGV/RGV, linked live to adjacent steps.
Solution 2: PCB ECI data upload
Temperature and O2 data go to the server via PCB ECI as e-records.
Solution 3: Early-warning system
Cameras, remote settings and smoke detectors flag faults, even at night.
Doors dock with AGV/RGV/MGV or robot arms, so changeovers don't wait for operators.
Traceable process data
A PLC touch panel on each oven sends temperature and O2 data via PCB ECI or SECS/GEM, leaving e-records per lot.
Drying safety warnings
Cameras, remote settings and smoke detectors target solvent and long-bake risks in PCB drying.
Solvent recovery
Recovers 25% of organic solvents released in baking.
Pressure degassing
Removes voids at up to 10 kgf/cm²; the door opens only after full depressurization.
Three smart-factory areas: transfer (AGV/RGV loading, live links to adjacent steps), connectivity (IoT-linked controllers, CPS uptime software) and traceability (e-records). Custom SECS/GEM for substrate tools; MES, EAP and ERP integration.
Track record
Order from a major Taiwanese substrate maker in 2017. 29th SMEA Innovation Research Award (2022); Taiwan Excellence Award (2024).
Custom builds
Sized to panel and load; options for fast air cooling, solvent recovery and quick-release liners; cart loading with two independent chambers for volume. All built in Taiwan.
Process Challenges
Challenge 1: Manual loading caps output
Hand-loading means long changeover waits.
Challenge 2: Bake data not traceable
Handwritten lot temperature logs can't meet PCB ECI.
Challenge 3: Drying safety risk
Solvent vapor and long bakes make night-time faults hard to catch.
Solution 1: AGV auto loading
Oven doors dock with AGV/RGV, linked live to adjacent steps.
Solution 2: PCB ECI data upload
Temperature and O2 data go to the server via PCB ECI as e-records.
Solution 3: Early-warning system
Cameras, remote settings and smoke detectors flag faults, even at night.
Hand-loading means long changeover waits.
Challenge 2: Bake data not traceable
Handwritten lot temperature logs can't meet PCB ECI.
Challenge 3: Drying safety risk
Solvent vapor and long bakes make night-time faults hard to catch.
Solution 1: AGV auto loading
Oven doors dock with AGV/RGV, linked live to adjacent steps.
Solution 2: PCB ECI data upload
Temperature and O2 data go to the server via PCB ECI as e-records.
Solution 3: Early-warning system
Cameras, remote settings and smoke detectors flag faults, even at night.
Key Capabilities
Automated loading
Doors dock with AGV/RGV/MGV or robot arms, so changeovers don't wait for operators.
Traceable process data
A PLC touch panel on each oven sends temperature and O2 data via PCB ECI or SECS/GEM, leaving e-records per lot.
Drying safety warnings
Cameras, remote settings and smoke detectors target solvent and long-bake risks in PCB drying.
Solvent recovery
Recovers 25% of organic solvents released in baking.
Pressure degassing
Removes voids at up to 10 kgf/cm²; the door opens only after full depressurization.
Doors dock with AGV/RGV/MGV or robot arms, so changeovers don't wait for operators.
Traceable process data
A PLC touch panel on each oven sends temperature and O2 data via PCB ECI or SECS/GEM, leaving e-records per lot.
Drying safety warnings
Cameras, remote settings and smoke detectors target solvent and long-bake risks in PCB drying.
Solvent recovery
Recovers 25% of organic solvents released in baking.
Pressure degassing
Removes voids at up to 10 kgf/cm²; the door opens only after full depressurization.
Service & Track Record
Integration
Three smart-factory areas: transfer (AGV/RGV loading, live links to adjacent steps), connectivity (IoT-linked controllers, CPS uptime software) and traceability (e-records). Custom SECS/GEM for substrate tools; MES, EAP and ERP integration.
Track record
Order from a major Taiwanese substrate maker in 2017. 29th SMEA Innovation Research Award (2022); Taiwan Excellence Award (2024).
Custom builds
Sized to panel and load; options for fast air cooling, solvent recovery and quick-release liners; cart loading with two independent chambers for volume. All built in Taiwan.
Three smart-factory areas: transfer (AGV/RGV loading, live links to adjacent steps), connectivity (IoT-linked controllers, CPS uptime software) and traceability (e-records). Custom SECS/GEM for substrate tools; MES, EAP and ERP integration.
Track record
Order from a major Taiwanese substrate maker in 2017. 29th SMEA Innovation Research Award (2022); Taiwan Excellence Award (2024).
Custom builds
Sized to panel and load; options for fast air cooling, solvent recovery and quick-release liners; cart loading with two independent chambers for volume. All built in Taiwan.
