Applications
Packaging Curing
Excess O2 in PI cure discolors films and weakens adhesion.
Challenge 2: Particles reduce yield
Oven-shed particles land on wafers and substrates.
Challenge 3: Uneven heat causes warpage
Large substrates warp or cure unevenly.
Solution 1: Low-oxygen curing
An auto-adjusting N2 circuit reaches as low as 10 ppm O2.
Solution 2: Clean chamber design
HEPA and clean materials reach up to Class 4.
Solution 3: Tuning in operation
±1.5% uniformity, tuned without cool-down.
Inert gas holds positive pressure while main and auxiliary N2 circuits switch flow automatically, reaching 10 ppm O2 to prevent film oxidation in PI cure.
Low O2 during cool-down
Indirect jacket cooling keeps outside air out, reducing film oxidation before unloading.
Clean chamber
99.97% HEPA filtration reaches up to ISO 14644-1 Class 4 @0.3 µm, keeping particles off wafers.
Uniform temperature
±1.5% uniformity, tunable while running, reducing warpage on large substrates.
Automation & communication
EFEM and robot loading, SECS/GEM host link, temperature and O2 data sent to your IT server.
Works with AGV/RGV and robot arms; PLCs send temperature and O2 data to your server.
Legacy oven upgrade
A wafer test house's third-party ovens could not be networked for traceability. WEISUN added PLCs on site with a central server and monitoring interface, one oven at a time, without removing it. Versus buying new, this saved at least 3 days to 1 week of downtime, with no recipe changes.
Equipment cybersecurity
SEMI E187 (2024); ISO/IEC 27001:2022 (2025).
Custom builds & record
Built in Taiwan. Supplied to major domestic OSATs and substrate makers; Taiwan Excellence Award 2024.
Process Challenges
Challenge 1: Residual oxygen degrades films
Excess O2 in PI cure discolors films and weakens adhesion.
Challenge 2: Particles reduce yield
Oven-shed particles land on wafers and substrates.
Challenge 3: Uneven heat causes warpage
Large substrates warp or cure unevenly.
Solution 1: Low-oxygen curing
An auto-adjusting N2 circuit reaches as low as 10 ppm O2.
Solution 2: Clean chamber design
HEPA and clean materials reach up to Class 4.
Solution 3: Tuning in operation
±1.5% uniformity, tuned without cool-down.
Excess O2 in PI cure discolors films and weakens adhesion.
Challenge 2: Particles reduce yield
Oven-shed particles land on wafers and substrates.
Challenge 3: Uneven heat causes warpage
Large substrates warp or cure unevenly.
Solution 1: Low-oxygen curing
An auto-adjusting N2 circuit reaches as low as 10 ppm O2.
Solution 2: Clean chamber design
HEPA and clean materials reach up to Class 4.
Solution 3: Tuning in operation
±1.5% uniformity, tuned without cool-down.
Key Capabilities
Low-oxygen curing
Inert gas holds positive pressure while main and auxiliary N2 circuits switch flow automatically, reaching 10 ppm O2 to prevent film oxidation in PI cure.
Low O2 during cool-down
Indirect jacket cooling keeps outside air out, reducing film oxidation before unloading.
Clean chamber
99.97% HEPA filtration reaches up to ISO 14644-1 Class 4 @0.3 µm, keeping particles off wafers.
Uniform temperature
±1.5% uniformity, tunable while running, reducing warpage on large substrates.
Automation & communication
EFEM and robot loading, SECS/GEM host link, temperature and O2 data sent to your IT server.
Inert gas holds positive pressure while main and auxiliary N2 circuits switch flow automatically, reaching 10 ppm O2 to prevent film oxidation in PI cure.
Low O2 during cool-down
Indirect jacket cooling keeps outside air out, reducing film oxidation before unloading.
Clean chamber
99.97% HEPA filtration reaches up to ISO 14644-1 Class 4 @0.3 µm, keeping particles off wafers.
Uniform temperature
±1.5% uniformity, tunable while running, reducing warpage on large substrates.
Automation & communication
EFEM and robot loading, SECS/GEM host link, temperature and O2 data sent to your IT server.
Service & Track Record
Automation integration
Works with AGV/RGV and robot arms; PLCs send temperature and O2 data to your server.
Legacy oven upgrade
A wafer test house's third-party ovens could not be networked for traceability. WEISUN added PLCs on site with a central server and monitoring interface, one oven at a time, without removing it. Versus buying new, this saved at least 3 days to 1 week of downtime, with no recipe changes.
Equipment cybersecurity
SEMI E187 (2024); ISO/IEC 27001:2022 (2025).
Custom builds & record
Built in Taiwan. Supplied to major domestic OSATs and substrate makers; Taiwan Excellence Award 2024.
Works with AGV/RGV and robot arms; PLCs send temperature and O2 data to your server.
Legacy oven upgrade
A wafer test house's third-party ovens could not be networked for traceability. WEISUN added PLCs on site with a central server and monitoring interface, one oven at a time, without removing it. Versus buying new, this saved at least 3 days to 1 week of downtime, with no recipe changes.
Equipment cybersecurity
SEMI E187 (2024); ISO/IEC 27001:2022 (2025).
Custom builds & record
Built in Taiwan. Supplied to major domestic OSATs and substrate makers; Taiwan Excellence Award 2024.
