From Problem to Patent
Chip and electronics baking must be clean and oxidation-free. WEISUN set up R&D in 2010 for it, then advanced via partners and public projects: special-process baking with a Japanese oven maker (2012), 530°C clean inert baking under MOEA SBIR (2016), ITRI smart baking (2022). Patents since 2015 cover energy, temperature and airflow, and chamber design. Tabs: milestones by capability, partners and awards, services.
Milestones
Heating and temperature control
1976 Precision hot-air baking with cart loading.
2010 Conveyor drying with IR/UV curing.
2025 Smart auto tuning: precise packaging control for steel carriers and glass panels.

Clean, low-O2
1988 Clean inert baking: single-pass cooling, cooling jacket, N2-saving divider; O2-free cool-down.
2015–2016 530°C clean inert: solvent recovery, air-curtain insulation, particle barrier.

Automation and integration
2017 Semi-automation: EAP upload, PLC/PC control.
2019 Unmanned loading: AGV/EFEM; SECS/GEM, PCB ECI.
2020 IoT monitoring: mobile app, e-traveler, CCD images.

Energy and heat recovery
2023 Heat recovery, early warning: pass-through layout, external chiller and temp control.
Joint Work
Since R&D opened in 2010, much of our technology came from partners and public projects, each tied to a process need:

2012 Special-process electronics baking with a Japanese oven maker.
2013 Drying process with a solar equipment partner to raise conversion efficiency.
2014 Semi-auto clean inert baking with PC/PLC control and comms; entry into the semiconductor supply chain.
2016 530°C clean inert baking under MOEA SBIR.
2022 ITRI smart baking project; 29th SME Innovation Research Award.
2024 32nd Taiwan Excellence Award, 18th Golden Torch Top 10 Products, SEMI E187 equipment cybersecurity.
R&D Services
R&D services cover six areas:

Mechanical and control: automatic dual doors, independent chambers, modular chamber.
Energy and safety: multi-layer dampers seal above 99%; heat recovery saves 20-25% energy and recovers 25% of solvents.
Industry 4.0/IoT: AGV/RGV/MGV and EFEM loading, SECS/GEM and PCB ECI, linked to line systems.
Data integration: PLC panel monitoring; temperature and O2 data to IT servers.
New technology: no convection in vacuum, so an IR array heating module does the work (2024 patent).
Needs analysis: we start from your process and weigh new design against retrofit.