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  • Industry 4.0 Automatic Drying Equipment
Products
  • Industry 4.0 Automatic Drying Equipment
  • Dust-Free Oxygen-Free Drying Equipment
  • General Drying Equipment
  • Specialized Drying Equipment
  • Customized Conveyor Drying Equipment
  • Environmental Testing Drying Equipment
  • Preheat Drying Equipment
  • Multi-functional Software System
Full-Automatic High-Temperature Dust And Oxygen-Free Oven
Full-Automatic High-Temperature Dust And Oxygen-Free Oven
Merchandise number:AQHWOL
Description:
  • The fully automated oven can be paired with EFEM or robotic arms, and relevant data can be directly uploaded to the server, achieving the goal of unmanned factory.
  •  Built-in sensors.
  • Built-in motor drives.

Features

Automation Control and IoT Integration
  • Built-in Sensors:To detect temperature, gas (O2 / N2) concentration, AGV battery capacity, positions of materials (Loader/Unloader/Ovens), and the status of automatic doors (open/close).
  • Built-in motor drives:Installing automatic switching motors and controllers for the oven, AGV (drive motors and stacking), and air flow control motors, each equipped with a networked PLC controller in both loader and oven. The connectivity between the loader and robotic arms is established through Wi-Fi.

Applications

        Industry automation in manufacturing for drying productions includes semiconductor, IC, PCB,Panel, ABF, LED, and electronics manufacturing. The equipment such as industrial dust-free drying oven, semiconductor industrial oven, circuit board industrial oven, PCB industrial oven, touch panel drying equipment,  ABF carrier board industrial oven, N2 hot air oven.

PC/PLC Controlled Oven Specification

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Specification
Process Temperature RT ~450℃
Temperature uniformity ± 1.5%
Cleanliness ISO14644-1 Class 5 @ 0.3 µm
Cooling Method Air Cooling(N2/CDA)、Water Cooling
Compatible Equipment EFEM 、Robotic arm
Oxygen Concentration 20ppm
Operation Interface User-Friendly operation interface, complies with CIM, Ethernet & SECS/GEM, PCB ECI
 Options .Fast air-cooling system
.Solvent recovery system
.Quick-detachable inner liner
Process Curing for chips and substrates in PR/PI processes; ideal for wafer-level and fan-out panel level packaging,
providing the optimal curing solution.
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