Full-automatic High Temperature Clean Oxidation Free Oven
Description：
- Full-automatic oven compatible with EFEM or robotic arms, which can directly upload relevant data to the server for achieving automatic operation of unmanned factories.
- Built-in sensors
- Built-in drives
Features
Automatic Control and Integration via IoT- Built-in sensors : temperature sensor, oxygen content detector, N2 content sensor, detector for battery capacity of automatic guided vehicle (AGV), detector for material presence (loader/unloader/oven), detector for automatic switching position.
- Built-in drives : one networked PLC controller is equipped between the loader and each of various oven devices such as oven automatic switching motor & controller, automatic guided vehicle (AGV) (driven motor and stacker) and flow control motor; and one loader and each robotic arm is connected via WiFi network.
Application
Various industries that require automated manufacturing, such as semiconductor, PCB, LED, electronics, etc.
OVEN SPECIFICATION (PLC／PC base)
Swipe right or left for more information| Specification | |
| Process Temperature | RT ~450℃ |
| Temperature uniformity | ± 1.5% |
| Cleanliness | Class 100 |
| Cooling Method | Air Cooling(N2/CDA)、Water Cooling |
| Compatible Devices | EFEM 、Robots |
| Oxygen Content | 20ppm |
| Operational Interface | HMI, compatible with CIM, Ethernet & SECS/GEM, PCB ECI |
| Optional Device | ．Fast air cooling ．Solvent recovery system ．Detachable inner liner |
| Process | Suitable for PR/PI curing and baking of wafer and substrate, which is the best curing solution for packaging wafers and fanout panels. |
