Smart Dust-Free & Oxygen-Free Oven
Tailored Thermal System for FOPLP Applications
Merchandise number：5P-S0013
Description：
Precision temperature control dedicated for semiconductor packaging
Ultra-clean, oxygen-free environment design
Intelligent auto temperature adjustment system
Tailored for temporary steel carriers & glass panels
Multiple loading/unloading configurations
Key Features
Precision Temperature Control for Semiconductor Packaging- Temperature uniformity within ±1.5%
- Optimized for critical FOPLP processes such as PI/BCB/PBO cure and copper annealing
Ultra-Clean Oxygen-Free Environment
- Suitable for Class 10~100 cleanroom applications
- In-chamber oxygen concentration < 50ppm, ensuring stable baking without oxidation
Intelligent Auto Temperature Adjustment System
- Automated recipe adjustment based on batch size, eliminating manual damper reset
- 28-zone automatic damper control for adaptive temperature regulation by substrate count
- High process repeatability, reduced manpower, and significant productivity improvement
Designed for Temporary Steel Carriers & Glass Panels
- Steel carrier size: 700 × 700mm / 4mm thickness / up to 20kg per sheet
- Glass panel sizes: 310 × 310 / 510 × 515 / 600 × 600 / 700 × 700 mm
- 12-layer reinforced rack system, each layer supports up to 20kg, fully meeting high-density packaging needs
Flexible Loading/Unloading Options
- Manual operation
- Automated integration (AMR + Robot, Conveyor + Robot)
Applications
Semiconductor drying equipment, PCB drying/baking systems, panel drying equipment, ABF substrate drying, LED curing processes, electronic component drying, nitrogen hot-air ovens, and other automated production lines requiring baking or drying processes.
Oven Specifications (PLC / PC-based)
| Specification | |
| Process Temperature | RT ~200℃ |
| Temperature Uniformity | ± 1.5% |
| Cleanroom Class | Class 10~100 |
| Cooling System | Air cooling (N2/CDA)、Water cooling |
| Compatible Equipment | ．Manual operation ．Automated systems (AMR + Robot , Conveyor + Robot) |
| Oxygen Concentration | 50ppm |
| User Interface | Intuitive control interface, compatible with ．CIM ．Ethernet & SECS/GEM ．PCB ECI |
| Optional Features | ．Rapid air-cooling system ．Solvent recovery system ．Quick-release inner liner system |
| Process Capability | ．Semiconductor packaging ．Advanced substrates（Glass / Steel / Polymer Carrier） ．Panel-level packaging (PLP) processes |
| Baking Capacity | ．Steel carriers：700x700mm / 4mm thickness / up to 20kg each ．Glass panels: 310x310 / 510x515 / 600x600 / 700x700 mm |
