As a leading expert in integrated light and heat process solutions, Weisun Industrial successfully participated in the 2025 Taiwan Printed Circuit Board International Exhibition (TPCA Show 2025) from October 22 to 24, presenting its next-generation intelligent drying systems and high-precision temperature control technologies. The exhibition drew strong interest from professionals and technical representatives across the PCB and semiconductor industries.
The featured systems were designed specifically for semiconductor packaging and PCB manufacturing, offering ±1.5% high-precision temperature uniformity, Class 10–100 cleanroom conditions, and oxygen levels below 50 ppm, ensuring process stability and consistent product quality. Integrating AI-driven energy management (W-AIMS), heat recovery systems, and nitrogen-saving technology, Weisun's equipment supports the industry's drive toward energy efficiency and sustainable production.
Throughout the show, Weisun's technical team held multiple on-site demonstrations, showcasing how intelligent automation and AI-based control help customers improve yield rates and production stability.
Mr. Tony Chen, General Manager of Weisun Industrial, stated:
“As the PCB and semiconductor industries continue to evolve, we aim to use TPCA Show as a platform to highlight Weisun’s innovations in drying technology and smart manufacturing. Our mission is to help customers achieve a balance between high precision and sustainable production.”
This successful participation underscores Weisun's professional expertise in light and heat process integration. Moving forward, Weisun remains committed to its core philosophy — ‘Baking Reliability, Delivering Quality’ — and will continue to provide energy-efficient, high-performance, and environmentally friendly drying solutions, partnering with global manufacturers to advance smart and sustainable manufacturing.
