WEISUN Industrial will participate in the 2025 SEMICON China Semiconductor Exhibition, where we will showcase our cutting-edge product developed specifically for the unique packaging requirements of the semiconductor industry: the "Full-Automatic High-Temperature Dust and Oxygen-Free Oven." This innovative solution represents a breakthrough in drying equipment for packaging processes. We look forward to discussing the future of the semiconductor industry with you on this international stage.
As semiconductor processes push the boundaries toward smaller process nodes, environmental control during manufacturing becomes increasingly critical. Precise control of temperature, cleanliness, and oxygen concentration is key to ensuring product yield during wafer production. Our Full-Automatic High-Temperature Dust and Oxygen-Free Oven series is specifically designed to meet these stringent standards.
Exhibition Highlight: Full-Automatic High-Temperature Dust and Oxygen-Free Oven
This equipment integrates seamlessly with EFEM or robotic arms and features an AI-driven intelligent monitoring system, enabling smart manufacturing and automated production. Key features include:
Fully Automated Operation:
Equipped with an automatic loading and unloading system to enhance production efficiency and product consistency while minimizing human error.
Intelligent Monitoring System:
Utilizes the latest industrial IoT technology for real-time monitoring, remote operation, and data analysis.
Precise Temperature Control Technology:
Industry-leading temperature control system ensures an optimal thermal processing environment for precision semiconductor components, with temperature uniformity reaching ±1.5°C for consistent heating.
Advanced Dust-Free Technology:
Achieves ISO14644-1 Class 5 cleanroom standards, effectively preventing particle contamination to ensure the highest wafer quality and meet strict semiconductor industry requirements.
Advanced Oxygen-Free Technology:
Precisely controls oxygen concentration to prevent wafer oxidation during processing, significantly improving yield and creating greater economic value for customers.
We understand that every customer has unique requirements. That’s why we offer comprehensive customization services, tailoring specifications, dimensions, temperature ranges, and automation levels to meet specific needs. At the exhibition, our professional technical team will provide a detailed introduction to our design philosophy and technical advantages, offering tailored solutions to address your production challenges.
We sincerely invite industry leaders to visit our booth, T3-T3221, during the 2025 SEMICON China exhibition. Let’s explore how advanced drying technology can create greater value for the semiconductor industry. We look forward to seeing you at the event!
2025 SEMICON China Exhibition Information:
Location: Shanghai New International Expo Centre
Booth No.: Hall T3, Booth T3221
Dates:
3/26 (Wed): 09:00–17:00
3/27 (Thu): 09:00–17:00
3/28 (Fri): 09:00–16:00
