Vacuum/Pressure Cure Oven
Description:
Integrated design for vacuum degassing and high-pressure void elimination
Pressure control accuracy within ±0.1 kg/cm²
Controlled low-oxygen environment to minimize metal oxidation risks
Temperature uniformity within ±3°C under high-pressure environments.
Class 100 clean curing environment
Key Features
Vacuum Degassing × High-Pressure Void Elimination: Effectively eliminate air bubbles
By seamlessly combining vacuum extraction and high-pressure regulation, this VPCO eliminates entrapped micro-bubbles inside encapsulation materials and bonding interfaces prior to full curing. Large voids are rapidly evacuated during the vacuum stage, followed by high-pressure compression that dissolves persistent micro-bubbles into the resin—maximizing package density and preventing delamination.
Ultra-Stable Pressure Regulation for Fragile Thin Wafers & High-Value Components
Delivering an exceptional pressure control accuracy within ±0.1 kg/cm², this VPCO minimizes pressure fluctuations during both compression and transient pressure phases. This ultra-gentle regulation makes it perfectly suited for thin wafers, advanced semiconductor components, and precision packaging, completely mitigating the risks of uneven stress distribution, substrate warpage, or micro-cracking.
Ultra-Low Oxygen Inert Atmosphere for Advanced Oxidation Prevention
This VPCO utilizes an efficient nitrogen purge and displacement process to strictly suppress oxygen levels within the process chamber to below 100 ppm. This controlled inert atmosphere provides comprehensive protection for delicate wire bonds, bond pads, and copper bumps, completely eliminating the risks of thermal oxidation and micro-corrosion during high-temperature baking cycles.
High-Precision Thermal Uniformity for Consistent Curing Profiles
Even under high-pressure environments, the process chamber of this VPCO guarantees exceptional temperature uniformity within ±3°C. The utilization of multi-point thermal monitoring, coupled with advanced forced-air convection technology, ensures identical heating for products across the upper, lower, and peripheral zones. This flawless thermal distribution completely mitigates the risks of localized premature curing, uneven volumetric shrinkage, and trapped micro-voids.
Class 100 Clean Curing Environment
Fully compliant with strict Class 100 cleanroom standards, this VPCO is engineered to eliminate particle contamination in high-cleanliness processes. This ultra-clean environment makes it the premier choice for advanced semiconductor packaging, next-generation electronic components, and high-precision optoelectronic materials that demand zero particle contamination.
Applications
Advanced Semiconductor Packaging Application
Perfectly optimized for next-generation backend processes—including Die Attach Film (DAF) bonding and capillary underfill (CUF)—this VPCO eradicates residual micro-voids at critical bonding interfaces and surrounding micro-bumps prior to thermal curing. This proactive void elimination drastically minimizes the risks of interface delamination, package cracking, and solder joint fractures, guaranteeing ultimate long-term package reliability.
Perfectly optimized for next-generation backend processes—including Die Attach Film (DAF) bonding and capillary underfill (CUF)—this VPCO eradicates residual micro-voids at critical bonding interfaces and surrounding micro-bumps prior to thermal curing. This proactive void elimination drastically minimizes the risks of interface delamination, package cracking, and solder joint fractures, guaranteeing ultimate long-term package reliability.
Electric Vehicle Power Modules (EV / IGBT / SiC)
Engineered specifically for high-reliability automotive applications, this VPCO is optimized for precision potting and sealing processes. It completely eradicates entrapped micro-voids within high-viscosity resins and silicone gels, ensuring maximum insulation integrity. By eliminating these thermal and electrical vulnerabilities prior to curing, the system prevents partial discharge, dielectric breakdown, and sealing failures, guaranteeing long-term vehicle safety and performance under high-voltage environments.
Engineered specifically for high-reliability automotive applications, this VPCO is optimized for precision potting and sealing processes. It completely eradicates entrapped micro-voids within high-viscosity resins and silicone gels, ensuring maximum insulation integrity. By eliminating these thermal and electrical vulnerabilities prior to curing, the system prevents partial discharge, dielectric breakdown, and sealing failures, guaranteeing long-term vehicle safety and performance under high-voltage environments.
Consumer Electronics & Display Panels (Display / Touch Panels / OCA)
Engineered to meet the stringent demands of high-definition displays, this VPCO is optimized for OCA lamination, touch glass bonding, polarizer attachment, and advanced optical bonding processes. By delivering an ultra-stable thermal and pressure-controlled environment, it completely eradicates lamination micro-bubbles and visual artifacts. This premium regulation ensures flawless optical clarity, maximizes luminous transmittance, and guarantees long-term bonding reliability against environmental aging.
Engineered to meet the stringent demands of high-definition displays, this VPCO is optimized for OCA lamination, touch glass bonding, polarizer attachment, and advanced optical bonding processes. By delivering an ultra-stable thermal and pressure-controlled environment, it completely eradicates lamination micro-bubbles and visual artifacts. This premium regulation ensures flawless optical clarity, maximizes luminous transmittance, and guarantees long-term bonding reliability against environmental aging.
OVEN SPECIFICATION (PLC / PC-based)
↔️Swipe right or left for more information
| Specification | |
| Max. Temperature | 250°C |
| Temperature Uniformity | 200°C ± 3°C(No-load) |
| Cleanliness Leve | Class 100 (verified by particle counter) |
| Temperature Controller | Digital setting and display, PID + SCR control |
| Automation Interface | Mechanical and electrical design optimized for EFEM loading/unloading |
| Oxygen Concentration | 20 ppm |
| Vacuum & Pressure System | ．Maximum Pressure：10 kgf/cm² ．1 atm to 8.5 kgf/cm² within 10 minutes ．Pressure Range：0 ~ 1.0 MPa ．Vacuum Level：5 Torr (Dry pump) |
| Safety Features | ．Mechanical pressure relief valve ．Electronic pressure transducer ．Software safety interlocks |
| Workpiece Specification | 12-inch wafers × 26 pcs; glass substrates 310 × 310 mm, cassette size 380 × 380 mm × 26 pcs |
